HS Code	Description	Data Type
38	Miscellaneous chemical products
3818	CHEMICAL ELEMENTS DOPED FOR USE IN ELECTRONICS, IN THE FORM OF DISCS, WAFERS OR SIMILAR FORMS; CHEMICAL COMPOUNDS DOPED FOR USE IN ELECTRONICS	Import Data/Export Data
381800	Chemical elements doped for use in electronics, in the form of discs, wafers or similar forms; chemical compounds doped for use in electronics	Import Data/Export Data
38180090	Other	Import Data/Export Data

Import Duty

Unit	kg
Rate of Duty (Tariff)	0
Rate of Duty (Effective)	N/A
Specific Duty (Rs)	N/A
CVD	12.36
2% Edu Cess	0
1% Edu Cess	0
Spl CVD	4
Total duty with 3% EC	17.240032

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Top 50 Import search result

Sr. No	Date	Country	Description	Quantity	Unit	Per Unit (INR)	Value (INR)	Port of Discharge
1	19-Jun-15	SWITZERLAND	HMT830.2 WAFERS (IC CHIPS IN THE FORM OF SILICON WAFERS)	4	NOS	66133.22	264532.89	Chennai Air Cargo ACC
2	19-Jun-15	UNITED STATES	PATTERNED SILICON WAFERS (IC CHIPS IN THE FORM OFSILICON WAFERS)	3	NOS	4839.42	14518.25	Chennai Air Cargo ACC
3	19-Jun-15	UNITED STATES	PATTERNED SILICON WAFERS (IC CHIPS IN THE FORM OFSILICON WAFERS)	2	NOS	8501.67	17003.35	Chennai Air Cargo ACC
4	16-Jun-15	CHINA	WAFER, 156MM X 156MM MULTI-CRYSTALLINE -A3 GRADE (SILICON WAFER)	500000	PCS	49.05	24524062.5	Bangalore ICD
5	16-Jun-15	FRANCE	WP10-3 INCHES GaAS EPITAXIAL WAFER (RAW MATERIALS) P/N: EPI WAFER 3P	160	NOS	27762.38	4441980	Hyderabad ACC
6	15-Jun-15	SINGAPORE	DIE SALES-A1180-WDQ(IC CHIPS IN THE FORM OF SILICON WAFERS)	21304	NOS	2.05	43707.49	Chennai Air Cargo ACC
7	15-Jun-15	SINGAPORE	PROCESSED WAFERS (IC CHIPS IN THE FORM OF SILICON WAFERS)	5	NOS	21791.42	108957.1	Chennai Air Cargo ACC
8	12-Jun-15	UNITED KINGDOM	SOIC WAFERS (IC CHIPS IN THE FORM OF SILICON WAFERS)	216	NOS	3923.85	847551.6	Chennai Air Cargo ACC
9	12-Jun-15	SINGAPORE	DIE SALES W73A-09B-WDQ (IC CHIPS IN THE FORM OFSILICON WAFERS)	46932	NOS	4.13	193687.56	Chennai Air Cargo ACC
10	12-Jun-15	SINGAPORE	DIE SALES VGA200A-WDQ (IC CHIPS IN THE FORM OFSILICON WAFERS)	4654	NOS	5.18	24110.1	Chennai Air Cargo ACC
11	12-Jun-15	SINGAPORE	DIE SALES PC20A-01A-WDQ (IC CHIPS IN THE FORM OFSILICON WAFERS)	12400	NOS	4.47	55398.21	Chennai Air Cargo ACC
12	12-Jun-15	UNITED STATES	UNSAWN SILICON WAFERS(IC CHIPS IN THE FORM OF SILICONWAFERS)	24	NOS	59171.9	1420125.68	Chennai Air Cargo ACC
13	12-Jun-15	SINGAPORE	PROCESSED WAFERS (IC CHIPS IN THE FORM OF SILICON WAFERS)	3	NOS	21791.42	65374.26	Chennai Air Cargo ACC
14	12-Jun-15	UNITED STATES	PATTERENED SILICON WAFERS (IC CHIPS IN THE FORM OFSILICON WAFERS)	4	NOS	3662.26	14649.04	Chennai Air Cargo ACC
15	12-Jun-15	FRANCE	NCD4000 WAFERS (IC CHIPS IN THE FORM OF SILICON WAFERS)	22	NOS	39606.36	871339.94	Chennai Air Cargo ACC
16	12-Jun-15	UNITED STATES	GSQUPP/GSQPUU Wafer (IC Chips in the form of Silicon Wafers)	9	NOS	31685.09	285165.8	Chennai Air Cargo ACC
17	11-Jun-15	JAPAN	RESISTORS KRN RDA N16 331G471G TP G633 1,445/WAFER (IC CHIPS IN THE FORM OF SILICON WAFERS) (6 PCS)	.2	KGS	95875.3	19175.06	Chennai Air Cargo ACC
18	11-Jun-15	JAPAN	RESISTORS KRN RNX Q16 5128 TP G633 1,540/WAFER (IC CHIPS IN THE FORM OF SILICON WAFERS) (6 PCS)	.2	KGS	95875.3	19175.06	Chennai Air Cargo ACC
19	11-Jun-15	JAPAN	RESISTORS KRN RNX Q16 5128 TP G633 1,540/WAFER (IC CHIPS IN THE FORM OF SILICON WAFERS) (6 PCS)	.2	KGS	95875.3	19175.06	Chennai Air Cargo ACC
20	11-Jun-15	JAPAN	RESISTORS KRN RNX Q16 5128 TP G633 1,530/WAFER (IC CHIPS IN THE FORM OF SILICON WAFERS) (6 PCS)	.2	KGS	95875.3	19175.06	Chennai Air Cargo ACC
21	11-Jun-15	JAPAN	RESISTORS KRN RNX Q16 5128 TP G633 1,535/WAFER (IC CHIPS IN THE FORM OF SILICON WAFERS) (6 PCS)	.2	KGS	95875.3	19175.06	Chennai Air Cargo ACC
22	11-Jun-15	JAPAN	RESISTORS KRN RNX Q16 5128 TP G633 1,520/WAFER (IC CHIPS IN THE FORM OF SILICON WAFERS) (6 PCS)	.2	KGS	95875.3	19175.06	Chennai Air Cargo ACC
23	11-Jun-15	FRANCE	WP10-3 INCHES GaAS EPITAXIAL WAFER (RAW MATERIALS) P/N: EPI WAFER 3P	160	NOS	27762.38	4441980	Hyderabad ACC
24	11-Jun-15	FRANCE	WP10-3 INCHES GaAS EPITAXIAL WAFER (RAW MATERIALS) P/N: EPI WAFER 3P	160	UNT	27762.38	4441980	Hyderabad ACC
25	10-Jun-15	POLAND	PV-FZ WAFER; B16-11000-0200-003; N/PH: 125 X 125MM, 1.0 - 5.0 AS PER P.O.	200	NOS	1593.15	318629.15	Hyderabad ACC
26	10-Jun-15	TAIWAN	MGO WAFER(DSP) 10X10X0.5MM TWO SIDE POLISHED(USE AS SUBSTRATES FOR THIN FILM DEPOSITION IN RESEARCH)	10	PCS	1894.2	18942.05	Delhi Air Cargo ACC
27	10-Jun-15	TAIWAN	MGO WAFER(SSP) 10X10X0.5MM ONE SIDE POLISHED(USE AS SUBSTRATES FOR THIN FILM DEPOSITION IN RESEARCH)	10	PCS	1715.77	17157.66	Delhi Air Cargo ACC
28	10-Jun-15	TAIWAN	SRTIO3 WAFER(SSP) 10X10X0.5MM ONE SIDE POLISHED(USE AS SUBSTRATES FOR THIN FILM DEPOSITION IN RESEARCH)	10	PCS	2470.7	24707.02	Delhi Air Cargo ACC
29	10-Jun-15	TAIWAN	LAAIO3 WAFER(SSP) 10X10X0.5MM ONE SIDE POLISHED(USE AS SUBSTRATES FOR THIN FILM DEPOSITION IN RESEARCH)	10	NOS	1853.03	18530.27	Delhi Air Cargo ACC
30	10-Jun-15	TAIWAN	SAPPHIRE WAFER /AI20O3(DSP) 10X10X0.5MM TWO SIDE POLISHED(USE AS SUBSTRATES FOR THIN FILM DEPOSITION IN RESEARCH)	20	NOS	1509.87	30197.47	Delhi Air Cargo ACC
31	10-Jun-15	TAIWAN	SAPPHIRE WAFER /AI20O3(SSP) 10X10X0.5MM ONE SIDE POLISHED(USE AS SUBSTRATES FOR THIN FILM DEPOSITION IN RESEARCH)	20	PCS	1372.61	27452.25	Delhi Air Cargo ACC
32	10-Jun-15	TAIWAN	SAPPHIRE WAFER /AI20O3 DIA 3"X0.5MM(USE AS SUBSTRATES FOR THIN FILM DEPOSITION IN RESEARCH)	2	PCS	10157.33	20314.66	Delhi Air Cargo ACC
33	11-Jun-15	UNITED STATES	SILICON WAFERS SPECIFICATION PRIME-CZ DIA 2 N-PHOSPHORUS ORIENTATION (100) +/- 0.5 DEGREE	50	NOS	1137.81	56890.59	Sahar Air Cargo ACC
34	10-Jun-15	KOREA,REPUBLIC OF	( SILICON WAFERS ) SI WAFER 3" DIA 500UMTH P/B <100>	100	PCS	1255.75	125574.77	Bangalore ACC
35	10-Jun-15	KOREA,REPUBLIC OF	( SILICON WAFERS ) SI WAFER 3"DIA 500UH TH P/B , WSIOWROO35 9 1-10OHM , PRIME SSP 2SEMI -STD <100>	100	PCS	1071.48	107148.04	Bangalore ACC
36	09-Jun-15	CHINA	IC CHIPS IN THE FORM OF SILICON WAFERS	53216	NOS	4.58	243613.54	Chennai Air Cargo ACC
37	08-Jun-15	UNITED STATES	IC CHIPS IN THE FORM OF SILICPN WAFERS	174242	NOS	3.27	569749.56	Chennai Air Cargo ACC
38	06-Jun-15	UNITED STATES	IC CHIPS IN THE FORM OF SILICON WAFERS	147400	NOS	5.64	831597.92	Chennai Air Cargo ACC
39	06-Jun-15	UNITED STATES	IC CHIPS IN THE FORM OF SILICON WAFERS	15734	NOS	4.38	68940.61	Chennai Air Cargo ACC
40	06-Jun-15	UNITED STATES	IC CHIPS IN THE FORM OF SILICON WAFERS	8031	NOS	3.27	26260.37	Chennai Air Cargo ACC
41	04-Jun-15	UNITED KINGDOM	SOIC WAFERS (IC CHIPS IN THE FORM OF SILICON WAFERS)	91	NOS	3896.58	354588.78	Chennai Air Cargo ACC
42	06-Jun-15	TAIWAN	HEAT CONDUCTIVE SILICONE RUBBER WITH FIBER GLASS, HSB18 X 38.6 X 0.3PI	100000	UNT	2.16	215811.75	Sahar Air Cargo ACC
43	06-Jun-15	TAIWAN	HEAT CONDUCTIVE SILICONE RUBBER WITH FIBER GLASS, HSB17.6 X 60 X 0.3	20000	UNT	4.9	98096.25	Sahar Air Cargo ACC
44	06-Jun-15	TAIWAN	HEAT CONDUCTIVE SILICONE RUBBER WITH FIBER GLASS, HSB17.5 X 33.5 X 0.3PI	200000	UNT	1.92	384537.3	Sahar Air Cargo ACC
45	06-Jun-15	TAIWAN	HEAT CONDUCTIVE SILICONE RUBBER WITH FIBER GLASS, HSB14.5 X 17.5 X 0.3PI	200000	UNT	1.28	255050.25	Sahar Air Cargo ACC
46	02-Jun-15	JAPAN	RESISTORS KRN RIA N16 1003B TP G633 1,715/WAFER (IC CHIPS IN THE FORM OF SILICON WAFERS) (6 PCS)	.24	KGS	81581.33	19579.52	Chennai Air Cargo ACC
47	02-Jun-15	JAPAN	RESISTORS KRN RIA N08 5001B TP G633 3,490/WAFER (IC CHIPS IN THE FORM OF SILICON WAFERS) (2 PCS)	.08	KGS	81581.38	6526.51	Chennai Air Cargo ACC
48	02-Jun-15	JAPAN	RESISTORS KRN RNX Q16 5128 TP G633 1,535/WAFER (IC CHIPS IN THE FORM OF SILICON WAFERS) (6 PCS)	.24	KGS	81581.33	19579.52	Chennai Air Cargo ACC
49	02-Jun-15	JAPAN	RESISTORS KRN RNX Q16 5128 TP G633 1,515/WAFER (IC CHIPS IN THE FORM OF SILICON WAFERS) (6 PCS)	.24	KGS	81581.33	19579.52	Chennai Air Cargo ACC
50	02-Jun-15	UNITED STATES	IC CHIPS IN THE FORM OF SILICON WAFERS	4039	NOS	4.35	17574.16	Chennai Air Cargo ACC
View all...

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Import Compulsory Compliance Requirements (CCR)

N/A

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Top 50 export search result

Sr. No	Date	Country	Description	Quantity	Unit	Per Unit (INR)	Value (INR)	Port of Discharge
Sorry no record found.

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Export Compulsory Compliance Requirements (CCR)

N/A